Introduces a science and engineering-oriented, high-level programming language. Studies the C language and its application in problem-solving in a structured programming environment. Includes the concepts and practice of structured programming, problem-solving, top-down design of algorithms, basic C syntax, control structures, arrays, and data structures.
The conference is followed by the Reliability Aware System Design and Test (RASDAT) workshop. EMBEDDED SYSTEMS DESIGNE1: Embedded Systems Hardware: HW/SW co-design, SoC, multi-core systems, board level hardware, HW security, Internet-of-Things (IoT) devices, sensors/actuators, displays.E2: Embedded Systems Software: Operating systems, firmware, algorithms, middleware, runtimes, parallelization, virtualization, software for low power, security, reliability, real-time support, emerging applications (e.g., automotive, telematics, analytics).E3: FPGA and Reconfigurable Systems: FPGA architecture and FPGA circuit design, CAD for FPGA, FPGA prototyping, FPGA-based accelerators.E4: Wireless Systems: Sensor networks, low-power wireless systems, wireless protocols, wireless power delivery.E5: Embedded Case Studies: Practical and industrial tools, methodologies, designs in various application areas: wireless, medical, networking, multimedia, automotive, controls, etc. DESIGN TOOLS AND EDAT1: Design Verification: Functional, formal, coverage-driven, hardware-assisted, and assertion-based verification, behavioral, RTL, and gate-level simulation, emulation, equivalence checking.T2: Test, Reliability, Fault-Tolerance: DFT, fault modelling and simulation, ATPG, BIST, repair, delay test, fault tolerance, online test, AIMS/RF test, board-level and system-level test, silicon debug, post-silicon validation, memory test, reliability testing.T3: Computer-Aided Design(CAD)tools: Logic and behavioral synthesis, logic mapping, simulation and formal verification, layout (partitioning, placement, routing, floor planning and compaction), post route optimizations. DESIGN METHODOLOGIES AND TECHNOLOGYM1: System-level Design: methodologies and architectures, processor and memory design, multi-core, GPU design, networks-on-chip, defect-tolerant architectures, accelerators, distributed system (e.g., automotive), cyber-physical systems.M2: Advances in Digital Design: Logic and physical synthesis, place and route, clock tree design, timing and signal integrity, design for manufacturability and yield, power integrity, variation-tolerant design.M3: Analog, Mixed-Signal and RF Design: Design of analog, mixed signal, and RF IP, high-speed wired and wireless interfaces, low-power analog and RF.M4: Power-Aware Design: Power analysis and estimation, optimization and low-power design, energy-efficient design, battery-aware design, thermal management, energy harvesting.M5: CMOS Technology and Devices: Deep nanoscale CMOS devices, device modeling and simulation, multi-domain simulation, device/circuit level reliability and variability.M6: Emerging Technologies: Post-CMOS devices, MEMS sensors, biomedical circuits, lab-on-chip, carbon nanotubes, silicon photonics, spintronic, memristors, neuromorphic and quantum computing. SAFE & SAFE AND SECURE INTELLIGENT SYSTEMSS1: Design for Safety and Relibility: Physically unclonable functions, random number generators, fault tolerance systems and architectures.S2: Secure Circuits and Systems: System security, side channel attacks and anti-piracy methodologies, Embedded systems security in healthcare, automotive, industrial and IoT applications.S3: Safety Assurance of Circuits/ Systems: Design for functional safety and certifications in airborne, health care, automotive systems. EMBEDDED TUTORIALS AND SPECIAL SESSIONS: Proposals in relevant emerging areas should be submitted as two-page abstracts.
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